Smart Thermoelectric Cooling Solutions
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    • S-Series TECs
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        • S-Series TECs
        • M-Series TECs
        • Customized TECs
        • TEC Assemblies
        • Researches and Development
      • Buyers guide
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      info@s-tt-s.com
      roman.d@s-tt-s.com
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      Products and services

      Description

      M-Series TECs

      «ST» presents «M-Series» TECs - from 2 to 5 cascades thermoelectric cooling devices with maximum temperature difference between its cold and hot side up to 130°C. «M-Series» is divided to the next subseries:

      MS – cascade TECs with standard pyramidal design;

      ME – TECs with enlarged surface of the top cascade (TEC cold side = TEC hot side). These TECs are able to provide the same cooling capacities and temperature differences as traditional pyramidal TECs but at bigger surface area of the cold side. Increased area and mechanical strength of the top cascades gives a possibility to work with relatively big cooled objects.

      ML – linear cascade TECs. The variation of ME-subseries TECs especially designed for deep cooling of oblong objects (CCDs, detector arrays etc.).

      To get more technical information about concrete TEC model please choose corresponding section below.

      Notes and Definitions

      Notes and Definitions section should be visited before start surfing catalogue of our products.

      Parameter Definition
      Imax, (A) TEC current at ΔTmax
      Umax, (V) TEC voltage at ΔTmax
      ΔTmax, (K) Maximum temperature difference between TEC cold and hot side (I=Imax, Qmax=0)
      Qmax, (W) Maximum TEC cooling capacity (I=Imax, ΔT=0)
      Th, (K) TEC hot side temperature
      H, (mm) TEC height
      Top=AxB, (mm) Dimensions of the TEC cold side
      Bottom=CxD, (mm) Dimensions of the TEC hot side
      General Notes:
      All TEC performance characteristics given for 30°C in vacuum
      All TEC dimensions given in millimeters
      To estimate TEC cooling capacity (Q ) at ΔT different from ΔTmax use equation Q=Qmax (1-ΔT/ΔTmax)
      To estimate TEC temperature difference (ΔT) at Q different from Qmax use equation
      ΔT = ΔTmax (1- Q/Qmax)

      Manufacturing Options

      All our standard and customized TECs can be implemented in a according to standard Manufacturing Options.

      1. TEC substrates a) High Purity Aluminum Oxide (Al2O3, 99.6 %)
      b) Aluminum Oxide (Al2O3, 96 %)
      c) Aluminum Nitride
      2. TEC internal solder a) PbSn (m/p: 183 °C)
      b) SnBi (m/p: 230 °C, Pb-free)
      c) AuSn (m/p: 280 °C, Pb-free) on request
      3. TEC outer surfaces treatment a) Naked ceramic (no metallization)
      b) Au plated (ready for wire bonding process)
      c) Metallized and pretinned with:
      - InSn (m/p: 117°C);
      - BiSn (m/p: 138°C);
      - In (m/p: 157°C);
      d) Other options can be implemented on request
      4. TEC current leads a) Pretinned copper wires (length can be varied on request)
      b) Insulated wires (length can be varied on request)
      c) Cu posts Au plated
      5. Thermistor Can be installed to the TEC cold/hot side on request
      M-Series TECs specifications

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      Products and services
      S-Series TECs
      M-Series TECs
      Customized TECs
      TEC Assemblies
      Researches and Development
      Applications
      Buyers guide
      About
      About
      News
      Career
      Scientific activity
      Contacts

      +7 4842 901-954
      Mon – Fri 9:30-18:00 (UTC+03:00)
      30 Turbostroiteley St., Kaluga 248032, Russia, PO: 1034
      info@s-tt-s.com
      roman.d@s-tt-s.com
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