Products and services
Description
«ST» presents «M-Series» TECs - from 2 to 5 cascades thermoelectric cooling devices with maximum temperature difference between its cold and hot side up to 130°C. «M-Series» is divided to the next subseries:
MS – cascade TECs with standard pyramidal design;
ME – TECs with enlarged surface of the top cascade (TEC cold side = TEC hot side). These TECs are able to provide the same cooling capacities and temperature differences as traditional pyramidal TECs but at bigger surface area of the cold side. Increased area and mechanical strength of the top cascades gives a possibility to work with relatively big cooled objects.
ML – linear cascade TECs. The variation of ME-subseries TECs especially designed for deep cooling of oblong objects (CCDs, detector arrays etc.).
To get more technical information about concrete TEC model please choose corresponding section below.
Notes and Definitions
Notes and Definitions section should be visited before start surfing catalogue of our products.
| Parameter | Definition |
|---|---|
| Imax, (A) | TEC current at ΔTmax |
| Umax, (V) | TEC voltage at ΔTmax |
| ΔTmax, (K) | Maximum temperature difference between TEC cold and hot side (I=Imax, Qmax=0) |
| Qmax, (W) | Maximum TEC cooling capacity (I=Imax, ΔT=0) |
| Th, (K) | TEC hot side temperature |
| H, (mm) | TEC height |
| Top=AxB, (mm) | Dimensions of the TEC cold side |
| Bottom=CxD, (mm) | Dimensions of the TEC hot side |
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General Notes: All TEC performance characteristics given for 30°C in vacuum All TEC dimensions given in millimeters To estimate TEC cooling capacity (Q ) at ΔT different from ΔTmax use equation Q=Qmax (1-ΔT/ΔTmax) To estimate TEC temperature difference (ΔT) at Q different from Qmax use equation ΔT = ΔTmax (1- Q/Qmax) |
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Manufacturing Options
All our standard and customized TECs can be implemented in a according to standard Manufacturing Options.
| 1. TEC substrates |
a) High Purity Aluminum Oxide (Al2O3, 99.6 %) b) Aluminum Oxide (Al2O3, 96 %) c) Aluminum Nitride |
| 2. TEC internal solder |
a) PbSn (m/p: 183 °C) b) SnBi (m/p: 230 °C, Pb-free) c) AuSn (m/p: 280 °C, Pb-free) on request |
| 3. TEC outer surfaces treatment |
a) Naked ceramic (no metallization) b) Au plated (ready for wire bonding process) c) Metallized and pretinned with: - InSn (m/p: 117°C); - BiSn (m/p: 138°C); - In (m/p: 157°C); d) Other options can be implemented on request |
| 4. TEC current leads |
a) Pretinned copper wires (length can be varied on request) b) Insulated wires (length can be varied on request) c) Cu posts Au plated |
| 5. Thermistor | Can be installed to the TEC cold/hot side on request |